Asian Modelica & FMI Conference 2026
We announce the Asian Modelica & FMI Conference 2026. It will take place at the high-tech city of Hangzhou, China from September 21-22, 2026 also famous of its stunning west lake scenery. It is organized by the Beihang University and Nanjing Yuansi SimTek Co., Ltd. in cooperation with the Modelica Association. This is the first visit of the conference series in China.

About the Conference
The Modelica & FMI conference will bring together people using Modelica and/or other Modelica Association standards for modeling, simulation, and control applications, such as Modelica language designers, tool vendors and library developers. The Modelica Conference provides Modelica users with the opportunity to stay informed about the latest language, library, and tool developments, and to get in touch with people working on similar modeling problems.
In addition to paper presentations, the conference features several Modelica tutorials for beginners and advanced users, as well as industrial user presentations, vendor sessions, and an exhibition.
Important Dates
| December 12, 2025 | Call for papers |
| April 30, 2026 | Deadline for scientific paper submissions |
| June 15, 2026 | Notification of acceptance for scientific papers and presentations |
| June 30, 2026 | Deadline for submission of industrial user presentations |
| June 30, 2026 | Deadline for submission of vendor presentations |
| July 15, 2026 | Notification of acceptance for industrial user presentations |
| July 31, 2026 | Deadline for early registration |
| August 1, 2026 | Submission of final papers, presentations, and one-page abstracts |
| September 21-22, 2026 | Asian Modelica & FMI Conference 2026 |
Call for Papers
You are encouraged to submit a full paper of at least 4 pages, with a maximum of 10 pages, on the following topics:
- Multi-engineering modeling and simulation with free or commercial Modelica libraries
- Applications and new tool developments for the Functional Mock-up Interface (FMI) and Layered Standards (LS)
- Applications and new tool developments for the System Structure and Parameterization (SSP) standard
- Applications and new tool developments for the FMI for embedded Systems (eFMI) standard
- System Simulation as an integrative part of Model-based Systems Engineering (MBSE)
- Machine Learning and AI in system simulation
- Automotive applications
- Applications in thermodynamic, energy systems and building physics
- Mechatronics and robotics applications
- Medicine and biology applications
- Maritime and offshore applications
- Other industrial applications, such as electric drives, power systems, aerospace, etc.
- Large-scale system modeling and simulation code generation for parallel computing architectures
- Real-time and hardware-in-the-loop applications; Code generation for embedded control systems
- Use of Artificial Intelligence (AI) methods in simulation; SimToReal for AI training purposes
- Applications of Modelica and FMI for optimization and control design
Prospective authors of scientific presentations are encouraged to submit a full paper (minimum 4 pages, maximum 10 pages) addressing the aforementioned topics by April 30, 2026. Each submission will undergo peer review by no fewer than 3 independent reviewers.
In line with conference tradition, the proceedings will be published by Linköping University Electronic Press (Linköping University, Sweden). For the 2026 Asian Modelica & FMI Conference, the organizing committee has collaborated with the Editorial Board of the International Journal of Modeling Simulation and Scientific Computing (IJMSSC). Selected papers from the conference proceedings will be recommended for publication in an IJMSSC Special Issue on Modelica, while outstanding submissions will be nominated for the journal’s regular issue. Both the Special Issue and Regular Issue of IJMSSC are indexed in EI.
Recommended authors are required to revise and restructure their manuscripts to comply with IJMSSC’s specific formatting guidelines and complete the journal’s subsequent peer review process. All associated publication costs shall be borne by the authors.
For industrial participants, in addition to submitting scientific papers, you may opt to present an industrial case study/presentation. For this category, only an abstract is required, with submissions due by June 30, 2026. Please note that these industrial presentations will not be included in the conference proceedings nor considered for the IJMSSC Special Issue.
You can also download the Call for papers and post it in your organization. The submission of your paper will be handled through the EasyChair Conference Management System.
Call for Sponsors and Vendor Presentations
Become a sponsor of the Asian Modelica & FMI Conference 2026! Please contact the conference organizers for more information.
Sponsoring Options
We offer exhibition and sponsoring in 4 different options:
| Platinum (max 2) | Gold | Silver | Logo(*) | |
|---|---|---|---|---|
| Price in CNY | 150,000 CNY | 100,000 CNY | 50,000 CNY | 38,000 CNY |
| Exhibition booth | 6m x 3m | 3m x 2m | 2m x 2m | - |
| Speech (30min) at main hall | Yes | - | - | - |
| Vendor session (25min) | Yes | Yes | - | - |
| Workshop (120min on Sep 20) | Yes | Yes | Yes | - |
| Free Tickets | 6 | 4 | 2 | 2 |
| Company logo on Web + Print | Yes | Yes | Yes | Yes |
| Banners in banquet hall | 2 | 1 | 1 | 1 |
| VIP Speech (10 min) at banquet | Yes | - | - | - |
Vendor presentation get the opportunity to present their products. Platinum and Gold sponsors qualify for a vendor presentation. Workshop shall have a tutorial character and are placed a day before the conference. The production of banners is up to the sponsor and not included in the sponsoring deal.
Conference Venue

The conference will take place in the main building of the Hangzhou Campus, Beihang University
- 166 Shuanghongqiao ST, Pingyao, Yuhang District, Hangzhou, China
The venue offers space for 3 parallel technical tracks and also a plenary hall for the shared sessions.
The program will be scheduled so that both Modelica and FMI interested have a full program to enjoy. Switching between sessions is not only possible but also encouraged.
Travel and Accommodation
We recommend to book your room in the Wyndham Garden Hotel Hangzhou Yuhang
- 2699 Yuhangtang Rd, Hangzhou, 311100, Zhejiang, China
A welcome reception will be provided on the evening of September 20 and the conference banquet in the evening of September 21 will take place in this hotel. We also aim to provide a shuttle service to the conference venue.
Transportation directly to Hangzhou:
- Flight: Hangzhou Xiaoshan International Airport (HGH), 57 Km
- Train: Hangzhou West Railway Station, 4.4Km
Most common International Travel:
- Nearest large Airport for many international guests is Shanghai Pudong International Airport (PVG).
- From there, a transfer train will bring you to Shanghai Hongqiao International Airport (SHA). Travel time (est. 30min, not including time at the airport)
- From (SHA) a high-speed train will bring you to Hangzhou West Railway Station (Travel time est. 80min)
Further travel advice for international guests will follow soon.
Organization and Contact
The conference is organized by organized by the Beihang University and Nanjing Yuansi SimTek Co., Ltd. in cooperation with the Modelica Association.
For general questions, please contact

Main Conference Board
- Prof. Shichun Yang, Beihang University
- Dr. Rui Gao, Nanjing Yuansi SimTek., Co., Ltd.
- Dr. Dirk Zimmer, German Aerospace Center (DLR), Germany
- Prof. Martin Sjolund, Linköping University, Sweden
- Prof. Haiying Lin, Beihang University
- Dr. Jian Wang, Beihang University
- Prof. Yanfang Liu, Beihang University
- Prof. WeiLin Li, Northwestern Polytechnical University
- Dr. OU Haiying, China SAE Automobile Model Digital Engineering Branch
- Dr. Hong Lü, China General Nuclear Power Corporation(CGN)
Conference Advisory Board
- Prof. Lin Zhang, Beihang University, China
- Dipl.-Math. Christian Bertsch, Robert Bosch GmbH, Germany
- Dr. Yutaka Hirano, Hirano research Laboratory, Japan
- Dr. Dai Araki, Toshiba Digital Solution, Japan
- Dr. Daeoh Kang, iVH, Korea
- Prof. Tielong Shen, Dalian Univ. of Technology & Emeritus Professor (Sophia Univ.)